(China (Mainland))
Product Summary
Gold Heatsink compounds high-end version of the gold-bearing cpu
Parametrics
INGREDIENTS:
siliconcompounds:50%
Carboncompounds:20%
Metaloxidecompounds:20%
Goldoxidecompounds:10%
Thermal resistance: <0.0.2°C-in2/W
Diagrams
| Image | Part No | Mfg | Description |  |
Pricing (USD) |
Quantity | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
 C1001A.18.02 |
|
2C/20AWG 7/28TC UNSHIELD 500' |
Data Sheet |
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| Image | Part No | Mfg | Description | |
Pricing (USD) |
Quantity | ||||||
 |
C100 |
Wiremold |
Wire Ducting Raceway Kit |
Data Sheet |
Negotiable |
|
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|
C1000A.18.02 |
|
2C/22AWG 7/30TC UNSHIELD 500' |
Data Sheet |
|
|
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|
C1000A.41.10 |
|
2C/22AWG 7/30TC UNSHIELD 1000' |
Data Sheet |
|
|
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|
C1000H-APS01 |
|
POWER SUPPLY BACKUP MODULE |
Data Sheet |
|
|
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|
C1000H-CE001 |
|
TERM BLOCK PLC F ADAPTER |
Data Sheet |
|
|
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|
C1000H-CN111 |
|
POWER SUPPLY CABLE 1 MODULE |
Data Sheet |
|
|
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