Product Summary
Gold Heatsink compounds high-end version of the gold-bearing cpu
Parametrics
INGREDIENTS:
siliconcompounds:50%
Carboncompounds:20%
Metaloxidecompounds:20%
Goldoxidecompounds:10%
Thermal resistance: <0.0.2°C-in2/W
Diagrams
Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
C1001A.18.02 |
2C/20AWG 7/28TC UNSHIELD 500' |
Data Sheet |
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Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||||
C100 |
Wiremold |
Wire Ducting Raceway Kit |
Data Sheet |
Negotiable |
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C1000A.18.02 |
2C/22AWG 7/30TC UNSHIELD 500' |
Data Sheet |
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C1000A.41.10 |
2C/22AWG 7/30TC UNSHIELD 1000' |
Data Sheet |
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C1000H-APS01 |
POWER SUPPLY BACKUP MODULE |
Data Sheet |
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C1000H-CE001 |
TERM BLOCK PLC F ADAPTER |
Data Sheet |
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C1000H-CN111 |
POWER SUPPLY CABLE 1 MODULE |
Data Sheet |
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